Multichip Packages

                    Get critical features and functions to maximize your design — high performance, high quality, power efficiency, wide density ranges, small package sizes, industrial temperature ranges and more — from our broad portfolio of industry-standard multichip packages (MCPs).

                    By Technology

                    View part catalogs, download data sheets, and find other product information.
                    e.MMC-Based MCP
                    Quick look
                    Benefits
                    • Embedded managed NAND and High Performance LPDRAM in a single package
                    • Simplified software solutions for complex high density NAND applications
                    • Technology
                      e.MMC, LPDDR2 SDRAM, LPDDR3 SDRAM, LPDDR4 SDRAM
                    • Densities
                      e.MMC: 4GB–32GB; LPDRAM: 4Gb–48Gb
                    • Package
                      WFBGA, VFBGA, TFBGA, POP
                    UFS-Based MCP (uMCP)
                    Quick look
                    Benefits
                    • Embedded managed NAND and high-performance LPDRAM in a single package.
                    • Enables high-density, low-power storage in a small footprint.
                    • Technology
                      LPDDR4 SDRAM, LPDDR4X SDRAM, UFS 3D NAND
                    • Densities
                      UFS: 32GB; LPDRAM: 24Gb (3GB)
                    • Package
                      WFBGA
                    NAND-Based MCP
                    Quick look
                    Benefits
                    • Offers high densities for data-intensive applications
                    • Provides high speeds, with x8, x16 and x32 bus widths
                    • Enables high reliability with SLC NAND that provides up to 100,000 PROGRAM/ERASE cycles
                    • Technology
                      LPDDR SDRAM, LPDDR2 SDRAM, LPDDR3 SDRAM, LPDDR4 SDRAM
                    • Densities
                      NAND: 1Gb - 8Gb
                    • Package
                      WFBGA, VFBGA, TFBGA, POP
                    NOR-Based MCP
                    Quick look
                    Benefits
                    • Simplifies design while speeding performance for low-density applications
                    • Reduces active ball count by more than 50% thanks to shared-bus and A/D MUX options
                    • Speeds boot-up and extends battery life with execute-in-place (XIP) functionality
                    • Supports low-voltage applications (1.8V)
                    • NOR Densities
                      32Mb - 512Mb
                    • Voltage
                      1.8V
                    • Package
                      TFBGA, VFBGA
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